HLMP-HB54 View Datasheet(PDF) - Avago Technologies
Part Name
Description
Manufacturer
HLMP-HB54 Datasheet PDF : 12 Pages
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Avago Technologies LED Configuration
CATHODE
Note: Electrical connection between bottom surface of LED die
and the lead frame material through conductive paste of solder.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB
during soldering process.
• At elevated temperature, the LED is more
susceptible to mechanical stress. Therefore, PCB
must be allowed to cool down to room temperature
prior to handling, which includes removal of jigs,
fixtures or pallet.
• Special attention must be given to board fabrication,
solder masking, surface platting and lead holes
size and component orientation to assure the
solderability.
• Recommended PC board plated through hole sizes for
LED component leads:
LED Component
Lead Size
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.508 x 0.508 mm
(0.020 x 0.020 inch)
Diagonal
0.646 mm
(0.025 inch)
0.718 mm
(0.028 inch)
Plated Through
Hole Diameter
0.976 to 1.078 mm
(0.038 to 0.042 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more information on
soldering LED components.
• Over sizing of plated through hole can lead to
twisting or improper LED placement during auto
insertion. Under sizing plated through hole can
lead to mechanical stress on the epoxy lens during
clinching.
TURBULENT WAVE
LAMINAR WAVE
HOT AIR KNIFE
250
200
TOP SIDE
OF PC BOARD
BOTTOM SIDE
OF PC BOARD
150
FLUXING
100
50
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C ± 5°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
LEAD SOLDER: SN63; FLUX: RMA
LEAD FREE SOLDER: 96.5% Sn, 3.0% Ag, 0.5% Cu
30
PREHEAT
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
0
10
20
30
40
50
60
70
80
90
100
TIME – SECONDS
Figure 8. Recommended wave soldering profile.
10
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