HMC346 View Datasheet(PDF) - Hittite Microwave
Part Name
Description
Manufacturer
HMC346 Datasheet PDF : 6 Pages
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Outline Drawing
v04.1008
1. ALL DIMENSIONS ARE IN INCHES (MILLIMETERS).
2. TYPICAL BOND PAD IS .004” SQUARE.
3. TYPICAL BOND PAD SPACING IS .006” CENTER TO
CENTER EXCEPT AS NOTED.
4. BACKSIDE METALIZATION: GOLD
5. BACKSIDE METAL IS GROUND
6. BOND PAD METALIZATION: GOLD
HMC346
GaAs MMIC VOLTAGE-VARIABLE
ATTENUATOR, DC - 20 GHz
1
Die Packaging Information [1]
Standard
Alternate
GP-2 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
Pad Descriptions
Pad Number
Function
1, 2
RF1 Input,
RF2 Output
Description
This pad is DC coupled and matched to 50 Ohm.
Blocking capacitors are required if RF line potential
is not equal to 0V.
3, 6
V2, V1
Control Input (Master).
Interface Schematic
4
I
Control Input (Slave).
5
500
This pad must be DC grounded.
GND
Die bottom must be connected to RF ground.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
1-5
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