ICS932S200YG-T View Datasheet(PDF) - Integrated Circuit Systems
Part Name
Description
Manufacturer
ICS932S200YG-T
Integrated Circuit Systems
ICS932S200YG-T Datasheet PDF : 12 Pages
| |||
ICS932S200
N
INDEX
AREA
12
D
c
L
E1 E
h x 45°
α
A
A1
-C-
e
b
SEATING
PLANE
.10 (.004) C
300 mil SSOP
SYMBOL
In Millimeters
In Inches
COMMON DIMENSIONS COMMON DIMENSIONS
MIN
MAX
MIN
MAX
A
2.413
2.794
.095
.110
A1
0.203
0.406
.008
.016
b
0.203
0.343
.008
.0135
c
0.127
0.254
.005
.010
D
SEE VARIATIONS
SEE VARIATIONS
E
10.033
10.668
.395
.420
E1
7.391
7.595
.291
.299
e
0.635 BASIC
0.025 BASIC
h
0.381
0.635
.015
.025
L
0.508
1.016
.020
.040
N
SEE VARIATIONS
SEE VARIATIONS
α
0°
8°
0°
8°
VARIATIONS
D mm.
N
MIN
MAX
56
18.288
18.542
D (inch)
MIN
MAX
.720
JEDEC MO-118
DOC# 10-0034
.730
6/1/00
REV B
Ordering Information
ICS932S200yF-T
Example:
ICS XXXX y F - PPP - T
Designation for tape and reel packaging
Pattern Number (2 or 3 digit number for parts with ROM code
patterns)
Package Type
F=SSOP
Revision Designator (will not correlate with datasheet revision)
Device Type (consists of 3 or 4 digit numbers)
Prefix
ICS, AV = Standard Device
0427C—07/03/02
11
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