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ILX554 View Datasheet(PDF) - Sony Semiconductor

Part Name
Description
Manufacturer
ILX554 Datasheet PDF : 13 Pages
First Prev 11 12 13
Package Outline
Unit: mm
22 pin DIP (400mil)
6.46 ± 0.5
41.6 ± 0.5
28.672 (14µm X 2048Pixels)
22
12
V
H
No.1 Pixel
1
11
1. The height from the bottom to the sensor surface is 2.45 ± 0.3mm.
2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5.
2.54
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
DRAWING NUMBER
Cer-DIP
TIN PLATING
42 ALLOY
5.20g
LS-A20(E)
0.51
0.3 M

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