ILX551B View Datasheet(PDF) - Sony Semiconductor
Part Name
Description
Manufacturer
ILX551B Datasheet PDF : 10 Pages
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ILX551B
Notes on Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling, be sure to take the following
protective measures.
a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive
shoes.
b) When handling directly use an eath band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) lonized air is recommended for discharge when handling CCD image sensors.
e) For the shipment of mounted substrates use cartons treated for the prevention of static charges.
2) Notes on handling CCD Cer-DIP package
The following points should be observed when handling and installing Cer-DIP packages.
a) Remain within the following limits when applying static load to the ceramic portion of the package:
(1) Compressive strength: 39N/surface
(Do not apply load more than 0.7mm inside the outer perimeter of the glass portion.)
(2) Shearing strength: 29N/surface
(3) Tensile strength:
29N/surface
(4) Torsional strength: 0.9Nm
Upper ceramic layer
39N
29N
29N
0.9Nm
Lower ceramic layer
(1)
Low-melting glass
(2)
(3)
(4)
b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be
generated and the package may fracture, etc., depending on the flatness of the ceramic portion.
Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.
c) Be aware that any of the following can cause the glass to crack because the upper and lower ceramic
layers are shielded by low-melting glass.
(1) Applying repetitive bending stress to the external leads.
(2) Applying heat to the external leads for an extended period of time with a soldering iron.
(3) Rapid cooling or heating.
(4) Rapid cooling or impact to a limited portion of the low-melting glass with a small-tipped tool such as
tweezers.
(5) Prying the upper or lower ceramic layers away at a support point of the low-melting glass.
Note that the preceding notes should also be observed when removing a component from a board after
it has already been soldered.
3) Soldering
a) Make sure the package temperature does not exceed 80°C.
b) Solder dipping in a mounting furnace causes demage to the glass abd other defects. Use a 30W
soldering iron with a ground wire and solder each pin in less than 2 seconds. For repairs and remount,
cool sufficiently.
c) To dismount image sensors, do not use a solder suction equipment. When using an electric desoldering
tool, ground the controller. For the control system, use a zero cross type.
–8–
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