ILX553B View Datasheet(PDF) - Sony Semiconductor
Part Name
Description
Manufacturer
ILX553B Datasheet PDF : 12 Pages
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ILX553B
3) Soldering
a) Make sure the package temperature does not exceed 80°C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a 30W soldering
iron with a ground wire and solder each pin in less then 2 seconds. For repairs and remount, cool
sufficiently.
c) To dismount an imaging device, do not use a solder suction equipment. When using an electric
desoldering tool, ground the controller. For the control system, use a zero cross type.
4) Dust and dirt protection
a) Operate in clean environments.
b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces.
Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity
ionized air is recommended.)
c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to
scratch the glass.
d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when
moving to a room with great temperature differences.
5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or
usage in such conditions.
6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks.
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