ISP1102 View Datasheet(PDF) - Philips Electronics
Part Name
Description
Manufacturer
ISP1102 Datasheet PDF : 23 Pages
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Philips Semiconductors
ISP1102
Advanced USB transceiver
Table 2: Pin description…continued
Symbol[1]
Pin
Type
HBCC16 HVQFN14
n.c.
6
-
-
VCC(I/O)
7
6
-
VBUSDET 8
7
O
D−
9
8
AI/O
D+
10
9
AI/O
n.c.
11
-
n.c.
12
-
n.c.
-
10
-
Vreg(3.3)
13
11
-
VCC(5.0)
14
12
-
Vpu(3.3)
15
13
-
Description
not connected
supply voltage for digital I/O pins (1.65 to 3.6 V). When VCC(I/O) is not
connected, the D+ and D− pins are in three-state. This supply pin is totally
independent of VCC(5.0) and Vreg(3.3) and must never exceed the Vreg(3.3)
voltage.
VBUS indicator output (CMOS level with respect to VCC(I/O)); when
VBUS > 4.1 V, then VBUSDET = HIGH and when VBUS < 3.6 V, then
VBUSDET = LOW; when SUSPND = HIGH, then pin VBUSDET is pulled
HIGH
output pad; push pull; 4 mA output drive; CMOS
negative USB data bus connection (analog, differential)
positive USB data bus connection (analog, differential)
not connected
not connected
not connected
internal regulator option: regulated supply voltage output (3.0 to 3.6 V)
during 5 V operation; a decoupling capacitor of at least 0.1 µF is required
regulator bypass option: used as a supply voltage input (3.3 V ±10%)
for 3.3 V operation
internal regulator option: supply voltage input (4.0 to 5.5 V); can be
connected directly to USB line VBUS
regulator bypass option: connect to Vreg(3.3)
pull-up supply voltage (3.3 V ±10%); connect an external 1.5 kΩ resistor
on D+ (full-speed).
Pin function is controlled by input SOFTCON:
SOFTCON 16
14
I
GND
exposed exposed -
die pad die pad
SOFTCON = LOW — Vpu(3.3) floating (high impedance); ensures zero
pull-up current
SOFTCON = HIGH — Vpu(3.3) = 3.3 V; internally connected to Vreg(3.3)
software controlled USB connection input; a HIGH level applies 3.3 V to
pin Vpu(3.3), which is connected to an external 1.5 kΩ pull-up resistor; this
allows USB connect or disconnect signalling to be controlled by software
input pad; push pull; CMOS
ground supply; down bonded to the exposed die pad (heatsink); to be
connected to the PCB ground
[1] Symbol names with an overscore (e.g. OE) indicate active LOW signals.
9397 750 11228
Product data
Rev. 03 — 02 September 2003
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
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