K4B2G1646C-HCF8 View Datasheet(PDF) - Samsung
Part Name
Description
Manufacturer
K4B2G1646C-HCF8 Datasheet PDF : 64 Pages
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K4B2G1646C
datasheet
3.2 FBGA Package Dimension (x16)
7.50 ± 0.10
0.80 x 8 = 6.40
0.80 1.60
3.20
9 8 76 5 4 3 2 1
A
#A1 INDEX MARK
B
A
(Datum A)
B
C
D
(Datum B)
E
F
G
H
J
K
L
M
N
P
R
T
96 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
0.2 M A B
(0.95)
(1.90)
MOLDING AREA
BOTTOM VIEW
Rev. 1.11
DDR3 SDRAM
Units : Millimeters
#A1
7.50 ± 0.10
TOP VIEW
-7-
0.35 ± 0.05
1.10 ± 0.10
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