K6X4008C1F View Datasheet(PDF) - Samsung
Part Name
Description
Manufacturer
K6X4008C1F Datasheet PDF : 9 Pages
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K6X4008C1F Family
CMOS SRAM
512Kx8 bit Low Power full CMOS Static RAM
FEATURES
• Process Technology: Full CMOS
• Organization: 512Kx8
• Power Supply Voltage: 4.5~5.5V
• Low Data Retention Voltage: 2V(Min)
• Three state output and TTL compatible
• Package Type: 32-DIP-600, 32-SOP-525,
32-TSOP2-400F/R
GENERAL DESCRIPTION
The K6X4008C1F families are fabricated by SAMSUNG′s
advanced full CMOS process technology. The families sup-
ports various operating temperature range and various
package types for user flexibility of system design. The fam-
ilies also support low data retention voltage for battery back-
up operation with low data retention current.
PRODUCT FAMILY
Product Family
K6X4008C1F-B
K6X4008C1F-F
Operating Temperature Vcc Range
Speed
Power Dissipation
Standby Operating
(ISB1, Max) (ICC2, Max)
Commercial (0~70°C)
Industrial (-40~85°C)
4.5~5.5V 551)/70ns
20µA
30mA
PKG Type
32-DIP-600, 32-SOP-525,
32-TSOP2-400F/R
K6X4008C1F-Q Automotive (-40~125°C)
30µA
32-SOP-525, 32-TSOP2-400F
1. The parameter is measured with 50pF test load.
PIN DESCRIPTION
A18
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O1
I/O2
I/O3
VSS
1
32
2
31
3
30
4
29
5
28
6
27
32-DIP
7
26
32-SOP
8 32-TSOP2 25
9 (Forward) 24
10
23
11
22
12
21
13
20
14
19
15
18
16
17
VCC
A15
A17
WE
A13
A8
A9
A11
OE
A10
CS
I/O8
I/O7
I/O6
I/O5
I/O4
VCC 32
1
A15 31
2
A17 30
3
WE
29
4
A13 28
5
A8 27
6
A9 26 32-TSOP2 7
A11 25 (Reverse) 8
OE
24
9
A10 23
10
CS
22
11
I/O8 21
12
I/O7 20
13
I/O6 19
14
I/O5 18
15
I/O4 17
16
A18
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O1
I/O2
I/O3
VSS
FUNCTIONAL BLOCK DIAGRAM
Clk gen.
Precharge circuit.
Row
Addresses
Row
select
Memory array
I/O1
Data
I/O Circuit
I/O8
cont
Column select
Data
cont
Pin Name
WE
CS
OE
A0~A18
I/O1~I/O8
Vcc
Vss
Function
Write Enable Input
Chip Select Input
Output Enable Input
Address Inputs
Data Inputs/Outputs
Power
Ground
CS
Control
WE
logic
OE
Column Addresses
SAMSUNG ELECTRONICS CO., LTD. reserves the right to change products and specifications without notice.
2
Revision 1.0
September 2003
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