L810HW View Datasheet(PDF) - Superworld Electronics
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L810HW Datasheet PDF : 10 Pages
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HIGH CURRENT MOLDED POWER INDUCTORS L810HW SERIES
11. SOLDERING AND MOUNTING :
11-1. Recommended PC Board Pattern
4.0
7.0
4.0
11-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
11-2.1 Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
11-2.2 Soldering Iron (Figure 2) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150°C.
b) 280°C tip temperature (max)
c) Never contact the ceramic with the iron tip
d) 1.0mm tip diameter (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 3 secs.
Preheating Soldering
250~260
230
10s max.
180
150
Natural
cooling
60~120s
30~60s
Figure 1. Re-flow Soldering
Preheating Soldering Natural
cooling
280
260
150
Over 1min.
Gradual
Cooling
Within 3secs.
Figure 2. Iron Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
25.08.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 8
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