LIS2L02AS4
7 Package Information
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect. The category of second Level Interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 17. SO24 Mechanical Data & Package Dimensions
DIM.
MIN.
mm
TYP. MAX. MIN.
inch
TYP. MAX.
A 2.35
2.65 0.093
0.104
A1 0.10
0.30 0.004
0.012
B 0.33
0.51 0.013
0.200
C 0.23
0.32 0.009
0.013
D (1) 15.20
15.60 0.598
0.614
E 7.40
7.60 0.291
0.299
e
1.27
0.050
H 10.0
10.65 0.394
0.419
h 0.25
0.75 0.010
0.030
L 0.40
1.27 0.016
0.050
k
0˚ (min.), 8˚ (max.)
ddd
0.10
0.004
(1) “D” dimension does not include mold flash, protusions or gate
burrs. Mold flash, protusions or gate burrs shall not exceed
0.15mm per side.
OUTLINE AND
MECHANICAL DATA
Weight: 0.60gr
SO24
12/14
0070769 C