LM2931ACD View Datasheet(PDF) - ON Semiconductor

Part Name

Description

Manufacturer

LM2931ACD

100 mA, Adjustable Output, LDO Voltage Regulator with 60 V Load Dump Protection

ON Semiconductor 

LM2931, NCV2931 Series

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Input Voltage Continuous

Transient Input Voltage (t ≤ 100 ms)

Transient Reverse Polarity Input Voltage

1.0% Duty Cycle, t ≤ 100 ms

VI

VI(t)

−VI(t)

40

Vdc

60

Vpk

− 50−

Vpk

Electrostatic Discharge Sensitivity (ESD)

Human Body Model (HBM) Class 2, JESD22 A114−C

Machine Model (MM) Class A, JESD22 A115−A

Charged Device Model (CDM), JESD22 C101−C

−

2000

V

−

200

V

−

2000

V

Power Dissipation

Case 29 (TO−92 Type)

TA = 25°C

Thermal Resistance, Junction−to−Ambient

Thermal Resistance, Junction−to−Case

Case 221A, 314A, 314B and 314D (TO−220 Type)

TA = 25°C

Thermal Resistance, Junction−to−Ambient

Thermal Resistance, Junction−to−Case

Case 318H (SOT−223)

TA = 25°C

Thermal Resistance, Junction−to−Ambient

Thermal Resistance, Junction−to−Case

Case 369A (DPAK) (Note 1)

TA = 25°C

Thermal Resistance, Junction−to−Ambient

Thermal Resistance, Junction−to−Case

Case 751 (SOP−8) (Note 2)

TA = 25°C

Thermal Resistance, Junction−to−Ambient

Thermal Resistance, Junction−to−Case

Case 936 and 936A (D2PAK) (Note 3)

TA = 25°C

Thermal Resistance, Junction−to−Ambient

Thermal Resistance, Junction−to−Case

PD

RqJA

RqJC

PD

RqJA

RqJC

PD

RqJA

RqJC

PD

RqJA

RqJC

PD

RqJA

RqJC

PD

RqJA

RqJC

Internally Limited

178

83

Internally Limited

65

5.0

Internally Limited

242

21

Internally Limited

92

6.0

Internally Limited

160

25

Internally Limited

70

5.0

W

°C/W

°C/W

W

°C/W

°C/W

W

°C/W

°C/W

W

°C/W

°C/W

W

°C/W

°C/W

W

°C/W

°C/W

Operating Ambient Temperature Range

TA

−40 to +125

°C

Operating Die Junction Temperature

TJ

+150

°C

Storage Temperature Range

Tstg

−65 to +150

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. DPAK Junction−to−Ambient Thermal Resistance is for vertical mounting. Refer to Figure 25 for board mounted Thermal Resistance.

2. SOP−8 Junction−to−Ambient Thermal Resistance is for minimum recommended pad size. Refer to Figure 24 for Thermal Resistance

variation versus pad size.

3. D2PAK Junction−to−Ambient Thermal Resistance is for vertical mounting. Refer to Figure 26 for board mounted Thermal Resistance.

4. NCV rated devices are subjected to and meet the AECQ−100 quality standards.

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