LPC2292 View Datasheet(PDF) - NXP Semiconductors.

Part Name

Description

Manufacturer

LPC2292

16/32-bit ARM microcontrollers; 256 kB ISP/IAP flash with CAN, 10-bit ADC and external memory interface

NXP Semiconductors. 

NXP Semiconductors

LPC2292/LPC2294

16/32-bit ARM microcontrollers with external memory interface

I 16 kB on-chip static RAM and 256 kB on-chip flash program memory. 128-bit wide

interface/accelerator enables high-speed 60 MHz operation.

I In-System Programming/In-Application Programming (ISP/IAP) via on-chip bootloader

software. Single flash sector or full chip erase in 400 ms and programming of 256 B in

1 ms.

I EmbeddedICE-RT and Embedded Trace interfaces offer real-time debugging with the

on-chip RealMonitor software as well as high-speed real-time tracing of instruction

execution.

I Two/four (LPC2292/2294) interconnected CAN interfaces with advanced acceptance

filters. Additional serial interfaces include two UARTs (16C550), Fast I2C-bus

(400 kbit/s) and two SPIs.

I Eight channel 10-bit ADC with conversion time as low as 2.44 µs.

I Two 32-bit timers (with four capture and four compare channels), PWM unit (six

outputs), Real-Time Clock (RTC), and watchdog.

I Vectored Interrupt Controller (VIC) with configurable priorities and vector addresses.

I Configurable external memory interface with up to four banks, each up to 16 MB and

8/16/32-bit data width.

I Up to 112 general purpose I/O pins (5 V tolerant). Up to nine edge/level sensitive

external interrupt pins available.

I 60 MHz maximum CPU clock available from programmable on-chip PLL with settling

time of 100 µs.

I On-chip crystal oscillator with an operating range of 1 MHz to 30 MHz.

I Power saving modes include Idle and Power-down.

I Processor wake-up from Power-down mode via external interrupt.

I Individual enable/disable of peripheral functions for power optimization.

I Dual power supply:

N CPU operating voltage range of 1.65 V to 1.95 V (1.8 V ± 0.15 V).

N I/O power supply range of 3.0 V to 3.6 V (3.3 V ± 10 %) with 5 V tolerant I/O pads.

3. Ordering information

Table 1. Ordering information

Type number

Package

Name

Description

LPC2292FBD144

LQFP144 plastic low profile quad flat package;

144 leads; body 20 × 20 × 1.4 mm

LPC2292FBD144/00 LQFP144 plastic low profile quad flat package;

144 leads; body 20 × 20 × 1.4 mm

LPC2292FBD144/01 LQFP144 plastic low profile quad flat package;

144 leads; body 20 × 20 × 1.4 mm

LPC2292FET144/00 TFBGA144 plastic thin fine-pitch ball grid array package;

144 balls; body 12 × 12 × 0.8 mm

LPC2292FET144/01 TFBGA144 plastic thin fine-pitch ball grid array package;

144 balls; body 12 × 12 × 0.8 mm

LPC2292FET144/G

TFBGA144 plastic thin fine-pitch ball grid array package;

144 balls; body 12 × 12 × 0.8 mm

Version

SOT486-1

SOT486-1

SOT486-1

SOT569-1

SOT569-1

SOT569-1

LPC2292_2294_6

Product data sheet

Rev. 06 — 10 December 2007

© NXP B.V. 2007. All rights reserved.

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