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LPC1788(2011) View Datasheet(PDF) - NXP Semiconductors.

Part Name
Description
Manufacturer
LPC1788 Datasheet PDF : 117 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
NXP Semiconductors
LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
4. Ordering information
Table 1. Ordering information
Type number
Package
Name
Description
LPC1788
LPC1788FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
LPC1788FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body
15 15 0.7 mm
LPC1788FET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 12 0.8 mm
LPC1788FBD144 LQFP144 plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm
LPC1787
LPC1787FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
LPC1786
LPC1786FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
LPC1785
LPC1785FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
LPC1778
LPC1778FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
LPC1778FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body
15 15 0.7 mm
LPC1778FET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 12 0.8 mm
LPC1778FBD144 LQFP144 plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm
LPC1777
LPC1777FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
LPC1776
LPC1776FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
LPC1776FET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 12 0.8 mm
LPC1774
LPC1774FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
LPC1774FBD144 LQFP144 plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm
Version
SOT459-1
SOT950-1
SOT570-2
SOT486-1
SOT459-1
SOT459-1
SOT459-1
SOT459-1
SOT950-1
SOT570-2
SOT486-1
SOT459-1
SOT459-1
SOT570-2
SOT459-1
SOT486-1
LPC178X_7X
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 27 May 2011
© NXP B.V. 2011. All rights reserved.
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