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LPC1774FBD208,551 View Datasheet(PDF) - NXP Semiconductors.

Part Name
Description
Manufacturer
LPC1774FBD208,551 Datasheet PDF : 126 Pages
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NXP Semiconductors
LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
4. Ordering information
Table 1. Ordering information
Type number
Package
Name
Description
LPC1788
LPC1788FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
LPC1788FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body
15 ´ 15 ´ 0.7 mm
LPC1788FET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm
LPC1788FBD144 LQFP144 plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm
LPC1787
LPC1787FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
LPC1786
LPC1786FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
LPC1785
LPC1785FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
LPC1778
LPC1778FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
LPC1778FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body
15 ´ 15 ´ 0.7 mm
LPC1778FET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm
LPC1778FBD144 LQFP144 plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm
LPC1777
LPC1777FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
LPC1776
LPC1776FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
LPC1776FET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm
LPC1774
LPC1774FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
LPC1774FBD144 LQFP144 plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm
Version
SOT459-1
SOT950-1
SOT570-3
SOT486-1
SOT459-1
SOT459-1
SOT459-1
SOT459-1
SOT950-1
SOT570-3
SOT486-1
SOT459-1
SOT459-1
SOT570-3
SOT459-1
SOT486-1
LPC178X_7X
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5.5 — 26 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
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