LPC47N267 View Datasheet(PDF) - SMSC -> Microchip
Part Name
Description
Manufacturer
LPC47N267 Datasheet PDF : 5 Pages
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100 Pin LPC Super I/O with X-Bus Interface
Package Outline
Figure 2 100 Pin STQFP, 12X12X1.4 Body, 2.0 MM Footprint
Table 1 100 Pin STQFP Package Parameters
MIN
NOMINAL
MAX
REMARK
A
~
~
A1
0.05
~
A2
1.35
1.40
D
13.80
14.00
D/2
6.90
7.00
D1
11.80
12.00
E
13.80
14.00
E/2
6.90
7.00
E1
11.80
12.00
H
0.09
~
L
0.45
0.60
L1
~
1.00
e
0.40 Basic
q
0o
3.5o
W
0.13
0.16
R1
0.08
~
1.60
0.15
1.45
14.20
7.10
12.20
14.20
7.10
12.20
0.20
0.75
~
7o
0.23
~
Overall Package Height
Standoff
Body Thickness
X Span
1/2 X Span Measure from Centerline
X body Size
Y Span
1/2 Y Span Measure from Centerline
Y body Size
Lead Frame Thickness
Lead Foot Length from Centerline
Lead Length
Lead Pitch
Lead Foot Angle
Lead Width
Lead Shoulder Radius
R2
0.08
~
ccc
~
~
ccc
~
~
ddd
~
~
0.20
.0762
0.08
0.035
Lead Foot Radius
Coplanarity (Assemblers)
Coplanarity (Test House)
True Position Spread (Bent Leads)
Notes:
1 Controlling Unit: millimeter
2 Minimum space between protrusion and an adjacent lead is .007 mm.
3 Details of pin 1 identifier are optional but must be located within the zone indicated
4Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5Shoulder widths must conform to JEDEC MS-026 dimension 'S' of a minimum of 0.20mm
SMSC LPC47N267
5
PRODUCT PREVIEW
Revision 01-03-05
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