LPC1315FBD48 View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
Manufacturer
LPC1315FBD48
32-bit ARM Cortex-M3 microcontroller; up to 64 kB flash; up to 12 kB SRAM; USB device; USART; EEPROM
NXP Semiconductors.
LPC1315FBD48 Datasheet PDF : 77 Pages
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NXP Semiconductors
LPC1315/16/17/45/46/47
32-bit ARM Cortex-M3 microcontroller
Processor wake-up from Deep-sleep and Power-down modes via reset, selectable
GPIO pins, watchdog interrupt, or USB port activity.
Processor wake-up from Deep power-down mode using one special function pin.
Integrated PMU (Power Management Unit) to minimize power consumption during
Sleep, Deep-sleep, Power-down, and Deep power-down modes.
Power-On Reset (POR).
Brownout detect with up to four separate thresholds for interrupt and forced reset.
Unique device serial number for identification.
Single 3.3 V power supply (2.0 V to 3.6 V).
Temperature range 40 C to +85 C.
Available as LQFP64, LQFP48, and HVQFN33 package.
3. Applications
Consumer peripherals
Medical
Industrial control
Handheld scanners
USB audio devices
4. Ordering information
Table 1. Ordering information
Type number Package
Name
Description
Version
LPC1345FHN33 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; n/a
body 7 7 0.85 mm
LPC1345FBD48 LQFP48 plastic low profile quad flat package; 48 leads; body 7 7 1.4 mm
SOT313-2
LPC1346FHN33 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; n/a
body 7 7 0.85 mm
LPC1346FBD48 LQFP48 plastic low profile quad flat package; 48 leads; body 7 7 1.4 mm
SOT313-2
LPC1347FHN33 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; n/a
body 7 7 0.85 mm
LPC1347FBD48 LQFP48 plastic low profile quad flat package; 48 leads; body 7 7 1.4 mm
SOT313-2
LPC1347FBD64 LQFP64 LQFP64: plastic low profile quad flat package; 64 leads; body 10 10
1.4 mm
SOT314-2
LPC1315FHN33 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; n/a
body 7 7 0.85 mm
LPC1315FBD48 LQFP48 plastic low profile quad flat package; 48 leads; body 7 7 1.4 mm
SOT313-2
LPC1316FHN33 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; n/a
body 7 7 0.85 mm
LPC1316FBD48 LQFP48 plastic low profile quad flat package; 48 leads; body 7 7 1.4 mm
SOT313-2
LPC1317FHN33 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; n/a
body 7 7 0.85 mm
LPC1317FBD48 LQFP48 plastic low profile quad flat package; 48 leads; body 7 7 1.4 mm
SOT313-2
LPC1317FBD64 LQFP64 LQFP64: plastic low profile quad flat package; 64 leads; body 10 10
1.4 mm
SOT314-2
LPC1315_16_17_45_46_47
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 20 September 2012
© NXP B.V. 2012. All rights reserved.
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