LT1764AEQ-1.8 View Datasheet(PDF) - Linear Technology
Part Name
Description
Manufacturer
LT1764AEQ-1.8 Datasheet PDF : 20 Pages
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LT1764A Series
PACKAGE DESCRIPTION
T Package
5-Lead Plastic TO-220 (Standard)
(Reference LTC DWG # 05-08-1421)
0.390 – 0.415
(9.906 – 10.541)
0.147 – 0.155
(3.734 – 3.937)
DIA
0.165 – 0.180
(4.191 – 4.572)
0.460 – 0.500
(11.684 – 12.700)
0.230 – 0.270
(5.842 – 6.858)
0.570 – 0.620
(14.478 – 15.748)
0.330 – 0.370
(8.382 – 9.398)
0.620
(15.75)
TYP
0.700 – 0.728
(17.78 – 18.491)
0.045 – 0.055
(1.143 – 1.397)
BSC 0.067
(1.70)
0.028 – 0.038
(0.711 – 0.965)
SEATING PLANE
0.152 – 0.202
0.260 – 0.320 (3.861 – 5.131)
(6.60 – 8.13)
0.135 – 0.165
(3.429 – 4.191)
0.095 – 0.115
(2.413 – 2.921)
0.155 – 0.195*
(3.937 – 4.953)
0.013 – 0.023
(0.330 – 0.584)
* MEASURED AT THE SEATING PLANE
T5 (TO-220) 0399
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation BB
3.58
(.141)
4.90 – 5.10*
(.193 – .201)
3.58
(.141)
16 1514 13 12 1110 9
6.60 ±0.10
4.50 ±0.10
SEE NOTE 4
2.94
(.116)
0.45 ±0.05
1.05 ±0.10
2.94 6.40
(.116) (.252)
BSC
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
4.30 – 4.50*
(.169 – .177)
0.25
REF
0° – 8°
12345678
1.10
(.0433)
MAX
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2.
DIMENSIONS
ARE
IN
MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE
0.65
(.0256)
BSC 0.195 – 0.30
(.0077 – .0118)
TYP
0.05 – 0.15
(.002 – .006)
FE16 (BB) TSSOP 0204
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
1764afb
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