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LT1943 View Datasheet(PDF) - Linear Technology

Part Name
Description
Manufacturer
LT1943 Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
LT1943
PACKAGE DESCRIPTIO
FE Package
28-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation EB
4.75
(.187)
6.60 ±0.10
4.50 ±0.10
SEE NOTE 4
2.74
(.108)
0.45 ±0.05
EXPOSED
PAD HEAT SINK
ON BOTTOM OF
PACKAGE
1.05 ±0.10
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
4.30 – 4.50*
(.169 – .177)
0.25
REF
0° – 8°
9.60 – 9.80*
(.378 – .386)
4.75
(.187)
28 2726 25 24 23 22 21 20 19 18 1716 15
2.74
(.108)
6.40
(.252)
BSC
1 2 3 4 5 6 7 8 9 10 11 12 13 14
1.20
(.047)
MAX
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
0.05 – 0.15
(.002 – .006)
FE28 (EB) TSSOP 0204
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
1943fa
19

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