LTC2916CDDB-1 View Datasheet(PDF) - Linear Technology
Part Name
Description
Manufacturer
LTC2916CDDB-1 Datasheet PDF : 12 Pages
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PACKAGE DESCRIPTION
TS8 Package
8-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1637)
0.52
0.65
MAX
REF
1.22 REF
LTC2915/LTC2916
2.90 BSC
(NOTE 4)
3.85 MAX 2.62 REF
1.4 MIN
2.80 BSC 1.50 – 1.75
(NOTE 4)
PIN ONE ID
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.20 BSC
DATUM ‘A’
0.65 BSC
0.80 – 0.90
1.00 MAX
0.22 – 0.36
8 PLCS (NOTE 3)
0.01 – 0.10
0.30 – 0.50 REF
0.09 – 0.20
NOTE:
(NOTE 3)
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
1.95 BSC
TS8 TSOT-23 0802
DDB Package
8-Lead Plastic DFN (3mm × 2mm)
(Reference LTC DWG # 05-08-1702 Rev B)
0.61 ±0.05
(2 SIDES)
2.55 ±0.05
1.15 ±0.05
0.70 ±0.05
0.25 ± 0.05
0.50 BSC
2.20 ±0.05
(2 SIDES)
PACKAGE
OUTLINE
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
3.00 ±0.10
(2 SIDES)
R = 0.05
TYP
R = 0.115
TYP
5
0.40 ± 0.10
8
2.00 ±0.10
(2 SIDES)
0.75 ±0.05
0.56 ± 0.05
(2 SIDES)
4
0.25 ± 0.05
PIN 1
R = 0.20 OR
0.25 × 45°
CHAMFER
1
(DDB8) DFN 0905 REV B
0.50 BSC
0 – 0.05
2.15 ±0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
29156fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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