M27V160-100B1TR View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
M27V160-100B1TR Datasheet PDF : 15 Pages
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M27V160
Table 7. Read Mode DC Characteristics (1)
(TA = 0 to 70°C or –40 to 85°C; VCC = 3.3V ± 10%; VPP = VCC)
Symbol
Parameter
Test Condition
Min
ILI
Input Leakage Current
ILO Output Leakage Current
ICC Supply Current
ICC1 Supply Current (Standby) TTL
0V ≤ VIN ≤ VCC
0V ≤ VOUT ≤ VCC
E = VIL, G = VIL, IOUT = 0mA,
f = 8MHz, VCC ≤ 3.6V
E = VIL, G = VIL, IOUT = 0mA,
f = 5MHz, VCC ≤ 3.6V
E = VIH
ICC2 Supply Current (Standby) CMOS
IPP Program Current
E > VCC – 0.2V, VCC ≤ 3.6V
VPP = VCC
VIL
Input Low Voltage
–0.3
VIH (2) Input High Voltage
0.7VCC
VOL Output Low Voltage
IOL = 2.1mA
VOH Output High Voltage TTL
IOH = –400µA
2.4
Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
2. Maximum DC voltage on Output is VCC +0.5V.
Max
±1
±10
30
20
1
60
10
0.2VCC
VCC + 1
0.4
Unit
µA
µA
mA
mA
mA
µA
µA
V
V
V
V
System Considerations
The power switching characteristics of Advanced
CMOS EPROMs require careful decoupling of the
supplies to the devices. The supply current ICC
has three segments of importance to the system
designer: the standby current, the active current
and the transient peaks that are produced by the
falling and rising edges of E. The magnitude of the
transient current peaks is dependent on the ca-
pacitive and inductive loading of the device out-
puts. The associated transient voltage peaks can
be suppressed by complying with the two line out-
put control and by properly selected decoupling
capacitors. It is recommended that a 0.1µF ceram-
ic capacitor is used on every device between VCC
and VSS. This should be a high frequency type of
low inherent inductance and should be placed as
close as possible to the device. In addition, a
4.7µF electrolytic capacitor should be used be-
tween VCC and VSS for every eight devices. This
capacitor should be mounted near the power sup-
ply connection point. The purpose of this capacitor
is to overcome the voltage drop caused by the in-
ductive effects of PCB traces.
5/15
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