MAX16936(2018) View Datasheet(PDF) - Maxim Integrated
Part Name
Description
Manufacturer
MAX16936
(Rev.:2018)
(Rev.:2018)
Maxim Integrated
MAX16936 Datasheet PDF : 17 Pages
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MAX16936/MAX16938
36V, 220kHz to 2.2MHz Step-Down Converters
with 28µA Quiescent Current
Absolute Maximum Ratings
SUP, SUPSW, EN to PGND....................................-0.3V to +42V
LX (Note 1).............................................................-0.3V to +42V
SUP to SUPSW......................................................-0.3V to +0.3V
BIAS to AGND..........................................................-0.3V to +6V
SYNCOUT, FOSC, COMP, FSYNC,
PGOOD, FB to AGND......................... -0.3V to (VBIAS + 0.3V)
OUT to PGND.........................................................-0.3V to +12V
BST to LX (Note 1)...................................................-0.3V to +6V
AGND to PGND....................................................-0.3V to + 0.3V
LX Continuous RMS Current....................................................3A
Output Short-Circuit Duration.....................................Continuous
Continuous Power Dissipation (TA = +70NC)*
TSSOP (derate 26.1mw/NC above +70NC)..............2088.8mW
TQFN (derate 28.6mw/NC above +70NC)................2285.7mW
Operating Temperature Range......................... -40NC to +125NC
Junction Temperature......................................................+150NC
Storage Temperature Range............................. -65NC to +150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
*As per JEDEC51 standard (multilayer board).
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Package Thermal Characteristics (Note 2)
TSSOP
Junction-to-Ambient Thermal Resistance (BJA)........38.3NC/W
Junction-to-Case Thermal Resistance (BJC)..................3NC/W
TQFN
Junction-to-Ambient Thermal Resistance (BJA)........... 35NC/W
Junction-to-Case Thermal Resistance (BJC)...............2.7NC/W
Note 1: Self-protected against transient voltages exceeding these limits for ≤ 50ns under normal operation and loads up to the
maximum rated output current.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(VSUP = VSUPSW = 14V, VEN = 14V, L1 = 2.2FH, CIN = 4.7FF, COUT = 22FF, CBIAS = 1FF, CBST = 0.1FF, RFOSC = 12kI,
TA = TJ = -40NC to +125NC, unless otherwise noted. Typical values are at TA = +25NC.)
PARAMETER
Supply Voltage
Load Dump Event Supply
Voltage
Supply Current
Shutdown Supply Current
BIAS Regulator Voltage
BIAS Undervoltage Lockout
BIAS Undervoltage-Lockout
Hysteresis
Thermal Shutdown Threshold
Thermal Shutdown Threshold
Hysteresis
SYMBOL
VSUP, VSUPSW
CONDITIONS
VSUP_LD
tLD < 1s
ISUP_STANDBY
ISHDN
VBIAS
VUVBIAS
Standby mode, no load, VOUT = 5V,
VFSYNC = 0V
Standby mode, no load, VOUT = 3.3V,
VFSYNC = 0V
VEN = 0V
VSUP = VSUPSW = 6V to 42V,
IBIAS = 0 to 10mA
VBIAS rising
MIN TYP MAX UNITS
3.5
36
V
42
V
28
40
FA
22
35
5
8
FA
4.7
5
5.4
V
2.95 3.15 3.40
V
450 650
mV
+175
NC
15
NC
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