DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

MAX44260_V4 View Datasheet(PDF) - Maxim Integrated

Part Name
Description
Manufacturer
MAX44260_V4 Datasheet PDF : 16 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
MAX44260/MAX44261
1.8V 15MHz Low-Offset,
Low-Power, Rail-to-Rail I/O Op Amps
ABSOLUTE MAXIMUM RATINGS
IN+, IN-, OUT..................................(VSS - 0.3V) to (VDD + 0.3V)
VDD to VSS................................................................-0.3V to +6V
SHDN, CAL..............................................................-0.3V to +6V
Output to Short-Circuit Ground Duration............................... 10s
Continuous Input Current into Any Pin............................. Q20mA
Continuous Power Dissipation (TA = +70NC)
SC70 (derate 3.1mW/NC above +70NC).......................245mW
6-Pin Thin µDFN (Ultra-Thin LGA)
(derate 2.1mW/NC above +70NC)..............................110.2mW
Operating Temperature Range......................... -40NC to +125NC
Junction Temperature......................................................+150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
SC70
Junction-to-Ambient Thermal Resistance (BJA)..... 326.5NC/W
Junction-to-Case Thermal Resistance (BJC)..............115NC/W
Thin µDFN (Ultra-Thin LGA)
Junction-to-Ambient Thermal Resistance (BJA)........ 470NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(VDD = 3.3V, VSS = 0V, VIN+ = VIN- = VDD/2, RL = 10kI to VDD/2, VCAL = VSHDN = VDD, TA = -40NC to +125NC. Typical values are
at TA = +25NC, unless otherwise noted.) (Note 2)
PARAMETER
DC CHARACTERISTICS
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
Input Voltage Range
VIN+ VIN- Guaranteed by CMRR test
-0.1
VDD
+ 0.1
V
Input Offset Voltage
Input Offset Voltage Drift
Input Bias Current (Note 3)
Input Capacitance
Common-Mode Rejection Ratio
Open-Loop Gain
Output Short-Circuit Current
VOS
VOS - TC
IB
CIN
CMRR
AOL
ISC
TA = +25NC
TA = -40°C to +125°C after calibration
TA = -40°C to +125°C
TA = +25NC
TA = -40NC to +85NC
TA = -40NC to +125NC
VCM = -0.1V to (VDD + 0.1V)
0.4V P VOUT P VDD - 0.4V, ROUT = 10kI
0.4V P VOUT P VDD - 0.4V, ROUT = 600I
0.4V P VOUT P VDD - 0.4V, ROUT = 32I
To VDD or VSS
10
50
100
FV
500
0.8
5
FV/NC
0.01 0.5
10
pA
100
0.4
pF
75
90
dB
100 115
91
100
dB
80
50
mA
  2

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]