MAX8520 View Datasheet(PDF) - Maxim Integrated
Part Name
Description
Manufacturer
MAX8520 Datasheet PDF : 18 Pages
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Smallest TEC Power Drivers for Optical
Modules
ABSOLUTE MAXIMUM RATINGS
VDD to GND ..............................................................-0.3V to +6V
SHDN, MAXV, MAXIP, MAXIN,
CTLI to GND .........................................................-0.3V to +6V
COMP, FREQ, OS1, OS2, CS, REF,
ITEC to GND...........................................-0.3V to (VDD + 0.3V)
PVDD1, PVDD2 to GND...............................-0.3V to (VDD + 0.3V)
PVDD1, PVDD2 to VDD ...........................................-0.3V to +0.3V
PGND1, PGND2 to GND .......................................-0.3V to +0.3V
COMP, REF, ITEC short to GND....................................Indefinite
LX Current (Note 1) ........................................±2.25A LX Current
Continuous Power Dissipation (TA = +70°C)
6 x 6 UCSP (derate 22mW/°C above +70°C) ...............1.75W
20-Pin 5mm x 5mm x 0.9mm TQFN (derate 20.8mW/°C
above +70°C) (Note 2)...................................................1.67W
36-Bump WLP (derate 22mW/°C above +70°C)............1.75W
Operating Temperature Range ...........................-40°C to +85°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: LX has internal clamp diodes to PGND and PVDD. Applications that forward bias these diodes should take care not to
exceed the IC’s package power dissipation limits.
Note 2: Solders underside metal slug to PCB ground plane.
ELECTRICAL CHARACTERISTICS
(VDD = VPVDD1 = VPVDD2 = VSHDN = 5V, 1MHz mode (Note 3). PGND1 = PGND2 = GND, CTLI = MAXV = MAXIP = MAXIN = REF,
TA = 0°C to +85°C, unless otherwise noted. Typical values at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
Input Supply Range
VDD
Maximum TEC Current
3.0
5.5
V
±1.5
A
Reference Voltage
Reference Load Regulation
MAXIP/MAXIN Threshold
Accuracy
NFET On-Resistance
PFET On-Resistance
NFET Leakage
PFET Leakage
No-Load Supply Current
VREF
∆VREF
RDS(ON-N)
RDS(ON-P)
ILEAK(N)
ILEAK(P)
IDD(NO
LOAD)
VDD = 3V to 5.5V, IREF = 150µA
VDD = 3V to 5V, IREF = 10µA to 1mA
VDD = 5V
VMAXI_ = VREF
VMAXI_ = VREF/3
VDD = 3V
VMAXI_ = VREF
VMAXI_ = VREF/3
VDD = 5V, I = 0.2A
VDD = 3V, I = 0.2A
VDD = 5V, I = 0.2A
VDD = 3V, I = 0.2A
VLX = VDD = 5V, TA = +25°C
VLX = VDD = 5V TA = +85°C
VLX = 0, TA = +25°C
VLX = 0, TA = +85°C
VCOMP = VREF =
1.500V, VDD = 5V
500kHz mode
1MHz mode
VCOMP = VREF = 500kHz mode
1.500V, VDD = 3.3V 1MHz mode
1.485 1.500 1.515
V
1.2
5.0
mV
140
150
160
40
50
60
mV
143
150
155
45
50
55
0.09 0.14
Ω
0.11 0.16
0.14 0.23
Ω
0.17 0.30
0.03 4.00
µA
0.3
0.03 4.00
µA
0.3
11
14
16
21
mA
8
11
11
14
Shutdown Supply Current
Thermal Shutdown
UVLO Threshold
IDD-SD SHDN = GND, VDD = 5V, (Note 4)
TSHUTDOWN Hysteresis = 15°C
VUVLO
VDD rising
VDD falling
2
3
mA
+165
°C
2.50 2.65 2.80
V
2.40 2.55 2.70
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