MBR160 View Datasheet(PDF) - ON Semiconductor
Part Name
Description
Manufacturer
MBR160 Datasheet PDF : 5 Pages
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1.0
0.7
0.5
0.3
0.2
0.1
0.07
0.05
0.03
0.02
0.01
0.1 0.2
MBR150, MBR160
THERMAL CHARACTERISTICS
0.5 1.0 2.0
ZqJL(t) = ZqJL • r(t)
Ppk
Ppk
DUTY CYCLE, D = tp/t1
tp
PEAK POWER, Ppk, is peak
TIME of an equivalent square
t1
power pulse.
DTJL = Ppk • RqJL [D + (1 − D) • r(t1 + tp) + r(tp) − r(t1)] where
DTJL = the increase in junction temperature above the lead
temperature r(t) = normalized value of transient thermal resistance
at time, t, from Figure 4, i.e.: r(t) = r(t1 + tp) = normalized value of
transient thermal resistance at time, t1 + tp.
5.0 10
20
50 100 200
500 1 k 2 k
5 k 10 k
t, TIME (ms)
Figure 4. Thermal Response
.
90
80
BOTH LEADS TO HEATSINK,
EQUAL LENGTH
70
60
MAXIMUM
50
TYPICAL
40
30
20
10
0 1/8 1/4 3/8 1/2 5/8 3/4 7/8 1.0
L, LEAD LENGTH (INCHES)
Figure 5. Steady−State Thermal Resistance
200
100
80
70
60
50
40
30
20
0
TJ = 25°C
f = 1 MHz
10 20 30 40 50 60 70 80 90 100
VR, REVERSE VOLTAGE (VOLTS)
Figure 6. Typical Capacitance
NOTE 1. — MOUNTING DATA:
Data shown for thermal resistance junction−to−ambient
(RqJA) for the mounting shown is to be used as a typical
guideline values for preliminary engineering or in case the
tie point temperature cannot be measured.
Typical Values for RqJA in Still Air
Mounting
Method
Lead Length, L (in)
1/8 1/4 1/2 3/4
1
52
65
72
85
2
67
80
87 100
3
—
50
RqJA
°C/W
°C/W
°C/W
NOTE 2. — THERMAL CIRCUIT MODEL:
(For heat conduction through the leads)
RqS(A)
RqL(A)
RqJ(A)
TA(A)
TL(A)
TC(A)
TJ
RqJ(K
)
PD
RqL(K)
RqS(K)
TA(K)
TC(K)
TL(K)
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