MC100EP016(2002) View Datasheet(PDF) - ON Semiconductor
Part Name
Description
Manufacturer
MC100EP016 Datasheet PDF : 12 Pages
| |||
MC10EP016, MC100EP016
A
A1
32
PACKAGE DIMENSIONS
LQFP
FA SUFFIX
32–LEAD PLASTIC PACKAGE
CASE 873A–02
ISSUE A
4X
0.20 (0.008) AB T-U Z
25
1
–T–
B
B1
8
9
DETAIL Y
–U–
V
17 V1
9
–Z–
4X
S1
0.20 (0.008) AC T-U Z
S
–AB–
SEATING
PLANE
–AC–
G
0.10 (0.004) AC
8X M_
R
CE
DETAIL AD
BASE
METAL
FÉÉÉÉNÉÉÉÉ D
J
SECTION AE–AE
W
H
K Q_
X
DETAIL AD
AE
P
AE
DETAIL Y
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -AB- IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS -T-, -U-, AND -Z- TO BE DETERMINED
AT DATUM PLANE -AB-.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE -AC-.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE -AB-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY VARY
FROM DEPICTION.
MILLIMETERS
DIM MIN MAX
A
7.000 BSC
A1 3.500 BSC
B
7.000 BSC
B1 3.500 BSC
C 1.400 1.600
D 0.300 0.450
E 1.350 1.450
F 0.300 0.400
G 0.800 BSC
H 0.050 0.150
J 0.090 0.200
K 0.500 0.700
M
12_ REF
N 0.090 0.160
P
0.400 BSC
Q
1_
5_
R 0.150 0.250
S
9.000 BSC
S1 4.500 BSC
V
9.000 BSC
V1 4.500 BSC
W 0.200 REF
X
1.000 REF
INCHES
MIN MAX
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.055 0.063
0.012 0.018
0.053 0.057
0.012 0.016
0.031 BSC
0.002 0.006
0.004 0.008
0.020 0.028
12_ REF
0.004 0.006
0.016 BSC
1_
5_
0.006 0.010
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
http://onsemi.com
11
Share Link: 