MC10H165 View Datasheet(PDF) - ON Semiconductor
Part Name
Description
Manufacturer
MC10H165 Datasheet PDF : 8 Pages
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B
A
16
B
1
E
F
MC10H165
PACKAGE DIMENSIONS
CDIP−16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620A−01
ISSUE O
A
M
9
L
8
16X J
0.25 (0.010) M T B
C
K
N
T
SEATING
PLANE
G
16X D
0.25 (0.010) M T A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
5 THIS DRAWING REPLACES OBSOLETE
CASE OUTLINE 620−10.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C −−− 0.200 −−− 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC
1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC
2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31
L 0.300 BSC
7.62 BSC
M
0_ 15_ 0_ 15_
N 0.020 0.040 0.51 1.01
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