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MC33151DR2G View Datasheet(PDF) - ON Semiconductor

Part Name
Description
Manufacturer
MC33151DR2G
ON-Semiconductor
ON Semiconductor ON-Semiconductor
MC33151DR2G Datasheet PDF : 12 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
MC34151, MC33151
High Speed Dual
MOSFET Drivers
The MC34151/MC33151 are dual inverting high speed drivers
specifically designed for applications that require low current digital
circuitry to drive large capacitive loads with high slew rates. These
devices feature low input current making them CMOS and LSTTL
logic compatible, input hysteresis for fast output switching that is
independent of input transition time, and two high current totem pole
outputs ideally suited for driving power MOSFETs. Also included is
an undervoltage lockout with hysteresis to prevent erratic system
operation at low supply voltages.
Typical applications include switching power supplies, dc to dc
converters, capacitor charge pump voltage doublers/inverters, and
motor controllers.
These devices are available in dualinline and surface mount
packages.
Features
Two Independent Channels with 1.5 A Totem Pole Output
Output Rise and Fall Times of 15 ns with 1000 pF Load
CMOS/LSTTL Compatible Inputs with Hysteresis
Undervoltage Lockout with Hysteresis
Low Standby Current
Efficient High Frequency Operation
Enhanced System Performance with Common Switching Regulator
Control ICs
Pin Out Equivalent to DS0026 and MMH0026
These are PbFree and HalideFree Devices
VCC 6
Logic Input A
2
+
+
+
-
5.7V
+
+
Drive Output A
7
+
Logic Input B
4
+
Drive Output B
5
http://onsemi.com
8
1
PDIP8
P SUFFIX
CASE 626
MARKING
DIAGRAMS
8
MC3x151P
AWL
YYWWG
1
8
1
8
SOIC8
3x151
D SUFFIX
CASE 751
ALYWG
G
1
MC3x151
8
3151V
ALYWG
G
1
MC33151V
x
= 3 or 4
A
= Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G or G = PbFree Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
N.C. 1
Logic Input A 2
GND 3
Logic Input B 4
8 N.C.
7 Drive Output A
6 VCC
5 Drive Output B
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
GND 3
Figure 1. Representative Block Diagram
© Semiconductor Components Industries, LLC, 2013
1
August, 2013 Rev. 9
Publication Order Number:
MC34151/D

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