MC33874BPNA/R2 View Datasheet(PDF) - ROHM Semiconductor

Part Name

Description

Manufacturer

MC33874BPNA/R2

Quad High Side Switch (Quad 35mΩ)

ROHM Semiconductor 

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings

Symbol

Value

Unit

ELECTRICAL RATINGS

Operating Voltage Range

Steady-State

VDD Supply Voltage

Input / Output Voltage(1)

SO Output Voltage(1)

WAKE Input Clamp Current

CSNS Input Clamp Current

HS [0:3] Voltage

Positive

Negative

Output Current(2)

Output Clamp Energy(3)

ESD Voltage(4)

Human Body Model (HBM)

Charge Device Model (CDM)

Corner Pins (1, 13, 19, 21)

All Other Pins (2-12, 14-18, 20, 22-24)

VPWR(SS)

V

-16 to 41

VDD

-0.3 to 5.5

V

See note (1)

- 0.3 to 7.0

V

VSO

-0.3 to VDD+0.3

V

ICL(WAKE)

2.5

mA

ICL(CSNS)

10

mA

VHS

V

41

-16

IHS[0:3]

11

A

ECL [0:3]

85

mJ

V

VESD

± 2000

± 750

± 500

THERMAL RATINGS

Operating Temperature

°C

Ambient

Junction

Storage Temperature

Thermal Resistance(5)

Junction to Case

Junction to Ambient

TA

TJ

TSTG

RθJC

RθJA

- 40 to 125

- 40 to 150

- 55 to 150

<1.0

30

°C

°C/ W

Peak Pin Reflow Temperature During Solder Mounting(6)

TSOLDER

Note 6

°C

Notes

1. Exceeding voltage limits on IN[0:3], RST, FSI, CSNS, TEMP, SI, SO, SCLK, CS, or FS pins may cause a malfunction or permanent

damage to the device.

2. Continuous high side output current rating so long as maximum junction temperature is not exceeded. Calculation of maximum output

current using package thermal resistance is required.

3. Active clamp energy using single-pulse method (L = 2mH, RL = 0Ω, VPWR = 14V, TJ = 150°C initial).

4. ESD testing is performed in accordance with the Human Body Model (CZAP = 100pF, RZAP = 1500Ω), Charge Device Model (CDM),

Robotic (CZAP = 4.0pF).

5. Device mounted on a 2s2p test board per JEDEC JESD51-2.

6. Freescale’s Package Reflow capability meets Sn-Pb-free requirements for JEDEC standard J-STD-020A. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL),

Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.

MC33xxxD enter 33xxx), and review parametrics.

Analog Integrated Circuit Device Data

Freescale Semiconductor

33874

5

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