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MCIMX35 View Datasheet(PDF) - Freescale Semiconductor

Part Name
Description
Manufacturer
MCIMX35 Datasheet PDF : 148 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
1 Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers
indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010:
Indicated by the Icon (!)
2 Case 5284 is RoHS-compliant, lead-free, MSL = 3, 1.
3 532 MHz rated devices meet all specifications of 400 MHz rated devices. A 532 MHz device can be substituted in place of a
400 MHz device.
The ball map for silicon revision 2.1 is different than the ballmap for silicon revision 2.0. The layout for
each revision is not compatible, so it is important that the correct ballmap be used to implement the layout.
See Section 5, “Package Information and Pinout.”
Table 2 shows the functional differences between the different parts in the i.MX35 family.
Table 2. Functional Differences in the i.MX35 Parts
Module
I2C (3)
CSPI (2)
SSI/I2S (2)
ESAI
SPDIF I/O
USB HS Host
USB OTG
FlexCAN (2)
MLB
Ethernet
1-Wire
KPP
SDIO/MMC (2)
SDIO/Memory Stick
External Memory Controller (EMC)
JTAG
PATA
CE-ATA
Image Processing Unit (IPU) (inversion and rotation, pre- and
post-processing, camera interface, blending, display controller)
Open VG graphics acceleration (GPU)
MCIMX351
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
MCIMX355
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
MCIMX356
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
i.MX35 Applications Processors for Automotive Products, Rev. 8
4
Freescale Semiconductor

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