MCM72F10DG12 View Datasheet(PDF) - Motorola => Freescale
Part Name
Description
Manufacturer
MCM72F10DG12 Datasheet PDF : 11 Pages
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ABSOLUTE MAXIMUM RATINGS (See Note 1)
Rating
Symbol
Value
Unit
Power Supply Voltage
Voltage Relative to VSS
(See Note 2)
VDD
– 0.5 to + 4.6
V
Vin, Vout
– 0.5 to VDD + 0.5
V
Input Voltage Three State I/O
(See Note 2)
VIT
VSS – 0.5 to VDD + 0.5
V
Output Current (per I/O)
Iout
± 20
mA
Power Dissipation
PD
4.6
W
Temperature Under Bias
Tbias
– 10 to + 85
°C
Storage Temperature
Tstg
– 55 to + 125
°C
NOTES:
1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are
exceeded. Functional operation should be restricted to RECOMMENDED OPER-
ATING CONDITIONS. Exposure to higher than recommended voltages for extended
periods of time could affect device reliability.
2. This is a steady–state DC parameter that is in effect after the power supply has
achieved its nominal operating level. Power sequencing can not be controlled and
is not allowed.
3. Power dissipation capability is dependent upon package characteristics and use
environment. See Package Thermal Characteristics.
This device contains circuitry to protect the
inputs against damage due to high static volt-
ages or electric fields; however, it is advised that
normal precautions be taken to avoid application
of any voltage higher than maximum rated volt-
ages to this high–impedance circuit.
PACKAGE THERMAL CHARACTERISTICS — PBGA
Rating
Symbol
Max
Unit Notes
Junction to Ambient (@ 200 lfm)
Single Layer Board
Four Layer Board
RθJA
41
°C/W 1, 2
19
Junction to Board (Bottom)
RθJB
11
°C/W
3
Junction to Case (Top)
RθJC
19
°C/W
4
NOTES:
1. Junction temperature is a function of on–chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, board population, and board thermal resistance.
2. Per SEMI G38–87.
3. Indicates the average thermal resistance between the die and the printed circuit board.
4. Indicates the average thermal resistance between the die and the case top surface via the cold plate method (MIL SPEC–883 Method
1012.1).
MOTOROLA FAST SRAM
MCM72F10
5
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