DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

RMTR10300 View Datasheet(PDF) - Raytheon Company

Part Name
Description
Manufacturer
RMTR10300
Raytheon
Raytheon Company Raytheon
RMTR10300 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
RMTR10300
10 – 30 GHz Tripler MMIC
Application
Information
ADVANCED INFORMATION
CAUTION: THIS IS AN ESD SENSITIVE DEVICE.
Chip carrier material should be selected to have GaAs compatible thermal coefficient of expansion and high
thermal conductivity such as copper molybdenum or copper tungsten. The chip carrier should be machined,
finished flat, plated with gold over nickel and should be capable of withstanding 325°C for 15 minutes.
Die attachment should utilize Gold/Tin (80/20) eutectic alloy solder and should avoid hydrogen environment for
PHEMT devices. Note that the backside of the chip is gold plated and is used as RF ground.
These GaAs devices should be handled with care and stored in dry nitrogen environment to prevent contamination
of bonding surfaces. These are ESD sensitive devices and should be handled with appropriate precaution including
the use of wrist grounding straps. All die attach and wire/ribbon bond equipment must be well grounded to prevent
static discharges through the device.
Recommended wire bonding uses 3 mils wide and 0.5 mil thick gold ribbon with lengths as short as practical
allowing for appropriate stress relief. The RF input and output bonds should be typically 0.012” long
corresponding to a typically 2 mil between the chip and the substrate material.
Figure 1
Functional Block
Diagram
Drain Supply
(Vd1)
Drain Supply
(Vd2)
Drain Supply
(Vd3)
MMIC Chip
RF IN
Fo
X3
RF OUT
3Fo
Figure 2 Dimensions in mm
Chip Layout and Bond
Pad Locations
0.113
Chip Size is 3.224 mm x
1.134 mm. Back of chip
is RF ground.
1.134
0.777
0.577
0.377
0.115
Gate Supply
(Vg1, Vg2 & Vg3)
Ground
(Back of Chip)
1.723 2.025
2.529
3.042
1.019
1.007
0.127
www.raytheon.com/micro
0.182
0.974
1.883
2.369
0.0
Characteristic performance data and specifications are subject to change without notice.
Revised April 6, 2001
Page 2
3.111
3.224
Raytheon RF Components
362 Lowell Street
Andover, MA 01810

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]