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MPC8544E View Datasheet(PDF) - Freescale Semiconductor

Part Name
Description
Manufacturer
MPC8544E Datasheet PDF : 117 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Freescale Semiconductor
Technical Data
Document Number: MPC8544EEC
Rev. 5, 01/2011
MPC8544E PowerQUICC III
Integrated Processor
Hardware Specifications
1 MPC8544E Overview
This section provides a high-level overview of MPC8544E
features. Figure 1 shows the major functional units within
the device.
1.1 Key Features
The following list provides an overview of the device feature
set:
• High-performance, 32-bit core enhanced by
resources for embedded cores defined by the Power
ISA, and built on Power Architecture® technology:
— 32-Kbyte L1 instruction cache and 32-Kbyte L1
data cache with parity protection. Caches can be
locked entirely or on a per-line basis, with
separate locking for instructions and data.
— Signal-processing engine (SPE) APU (auxiliary
processing unit). Provides an extensive
instruction set for vector (64-bit) integer and
fractional operations. These instructions use both
the upper and lower words of the 64-bit GPRs as
they are defined by the SPE APU.
Contents
1. MPC8544E Overview . . . . . . . . . . . . . . . . . . . . . . . . . .1
2. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . .8
3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .13
4. Input Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
5. RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . .16
6. DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . .16
7. DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
8. Enhanced Three-Speed Ethernet (eTSEC),
MII Management . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
9. Ethernet Management Interface Electrical
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
10. Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
11. Programmable Interrupt Controller . . . . . . . . . . . . . .55
12. JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56
13. I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
14. GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
15. PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61
16. High-Speed Serial Interfaces (HSSI) . . . . . . . . . . . . .63
17. PCI Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73
18. Package Description . . . . . . . . . . . . . . . . . . . . . . . . . .81
19. Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .93
20. Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .96
21. System Design Information . . . . . . . . . . . . . . . . . . .105
22. Device Nomenclature . . . . . . . . . . . . . . . . . . . . . . . .114
23. Document Revision History . . . . . . . . . . . . . . . . . . .116
© 2010 Freescale Semiconductor, Inc.

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