MPXH6250A View Datasheet(PDF) - Motorola => Freescale
Part Name
Description
Manufacturer
MPXH6250A Datasheet PDF : 8 Pages
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FLUORO SILICONE
GEL DIE COAT
WIRE BOND
LEAD
FRAME
Freescale Semiconductor, Inc.
DIE
P1
STAINLESS
STEEL CAP
THERMOPLASTIC
CASE
100 nF
+5.1 V
VS Pin 2
MPXH6250A
Vout Pin 4
ABSOLUTE ELEMENT
SEALED VACUUM REFERENCE
DIE BOND
GND Pin 3
47 pF
to ADC
51 K
Figure 2. Cross Sectional Diagram SSOP
(not to scale)
Figure 2 illustrates the absolute sensing chip in the basic
Super Small Outline chip carrier (Case 1317).
Figure 3. Typical Application Circuit
(Output Source Current Operation)
Figure 3 shows a typical application circuit (output source
current operation).
5.0
4.5 TRANSFER FUNCTION:
4.0
Vout = Vs* (0.0040*P-0.040) ± Error
VS = 5.1 Vdc
3.5 TEMP = 0 to 85°C
3.0
2.5
MAX
2.0
1.5
TYP
1.0
0.5
MIN
0
Pressure (ref: to sealed vacuum) in kPa
Figure 4. Output versus Absolute Pressure
Figure 4 shows the sensor output signal relative to pres-
sure input. Typical minimum and maximum output curves
are shown for operation over 0 to 85°C temperature range.
The output will saturate outside of the rated pressure range.
A fluorosilicone gel isolates the die surface and wire
bonds from the environment, while allowing the pressure
signal to be transmitted to the silicon diaphragm. The
MPXH6250A series pressure sensor operating characteris-
tics, internal reliability and qualification tests are based on
use of dry air as the pressure media. Media other than dry
air may have adverse effects on sensor performance and
long–term reliability. Contact the factory for information re-
garding media compatibility in your application.
Motorola Sensor Device Data For More Information On This Product,
Go to: www.freescale.com
MPXH6250A SERIES
3
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