MPXH6250A6U View Datasheet(PDF) - Motorola => Freescale

Part Name

Description

Manufacturer

MPXH6250A6U

High Temperature Accuracy Integrated Silicon Pressure Sensor

Motorola => Freescale 

Freescale Semiconductor, Inc.

SURFACE MOUNTING INFORMATION

MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL OUTLINE PACKAGES

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor package must

be the correct size to ensure proper solder connection inter-

face between the board and the package. With the correct

pad geometry, the packages will self–align when subjected to

a solder reflow process. It is always recommended to fabri-

cate boards with a solder mask layer to avoid bridging and/or

shorting between solder pads, especially on tight tolerances

and/or tight layouts.

0.150

3.81

0.050

1.27

TYP

0.387

9.83

0.027 TYP 8X

0.69

0.053 TYP 8X

inch

1.35

mm

Figure 5. SSOP Footprint (Case 1317 and 1317A)

Motorola Sensor Device Data For More Information On This Product,

Go to: www.freescale.com

MPXH6250A SERIES

5

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