MPXH6250A(2007) View Datasheet(PDF) - Freescale Semiconductor

Part Name

Description

Manufacturer

MPXH6250A
(Rev.:2007)

High Temperature Accuracy Integrated Silicon Pressure Sensor

Freescale Semiconductor 

Transfer Function (MPXH6250A)

Nominal Transfer Value: Vout = VS x (0.004 x P - 0.040)

± (Pressure Error x Temp Factor x 0.004 x VS)

VS = 5.1 ± 0.36 Vdc

Temperature Error Band

4.0

3.0

Temperature

Error

2.0

Factor

1.0

MPXH6250A Series

Break Points

Temp

-40

0 to 85

125

Multiplier

3

1

1.75

0.0

-40 -20

0

20 40 60 80 100 120 140

Temperature in °C

NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C.

Pressure Error Band

4.0

3.0

2.0

1.0

0.0

20

-1.0

-2.0

-3.0

-4.0

60 100 140 180 220 260 300

Error Limits for Pressure

Pressure (in kPa)

Pressure

Error (Max)

20 to 250 (kPa) ±3.45 (kPa)

SURFACE MOUNTING INFORMATION

Minimum Recommended Footprint for Super Small Outline Packages

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor package must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct pad

geometry, the packages will self-align when subjected to a

solder reflow process. It is always recommended to fabricate

boards with a solder mask layer to avoid bridging and/or

shorting between solder pads, especially on tight tolerances

and/or tight layouts.

0.150

3.81

0.050

1.27

TYP

0.387

9.83

0.027 TYP 8X

0.69

0.053 TYP 8X

inch

1.35

mm

Figure 5. SSOP Footprint (Case 1317 and 1317A)

Sensors

Freescale Semiconductor

MPXH6250A

5

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