MPXH6250A View Datasheet(PDF) - Freescale Semiconductor
Part Name
Description
Manufacturer
MPXH6250A Datasheet PDF : 12 Pages
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Pressure
On-chip Temperature Compensation and Calibration
Figure 2 illustrates the absolute sensing chip in the basic
Super Small Outline chip carrier (Case 1317). Figure 3
illustrates a typical application circuit (output source current
operation).
Figure 4 shows the sensor output signal relative to
pressure input. Typical minimum and maximum output
curves are shown for operation over 0 to 85C temperature
range. The output will saturate outside of the rated pressure
range.
Fluorosilicone
Gel Die Coat
P1
Wire Bond
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MPXH6250A
series pressure sensor operating characteristics, internal
reliability and qualification tests are based on use of dry air as
the pressure media. Media other than dry air may have
adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media
compatibility in your application.
Die
Stainless Steel Cap
Thermoplastic Case
Lead Frame
Absolute Element
Die Bond
Sealed Vacuum Reference
Figure 2. Cross Sectional Diagram SSOP
(not to scale)
+5.1 V
100 nF
VS Pin 2
MPXH6250A
VOUT Pin 4
GND Pin 3
47 pF
To ADC
51 K
MPXH6250A
4
Figure 3. Typical Application Circuit
(Output Source Current Operation)
5.0
4.5
Transfer Function:
Vout = Vs*(0.0040*P-0.040) ± Error
4.0 VS = 5.1 Vdc
3.5 Temperature = 0 to 85°C
3.0
2.5
MAX
TYP
2.0
1.5
1.0
0.5
MIN
0
Pressure (Reference to Sealed Vacuum) in kPa
Figure 4. Output vs. Absolute Pressure
Sensors
Freescale Semiconductor, Inc.
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