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MSM9811GA View Datasheet(PDF) - Oki Electric Industry

Part Name
Description
Manufacturer
MSM9811GA Datasheet PDF : 44 Pages
First Prev 41 42 43 44
OKI Semiconductor
PACKAGE DIMENSIONS
QFP64-P-1414-0.80-BK
FEDL9811FULL-04
MSM9811
(Unit: mm)
Mirror finish
5
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
42 alloy
Solder platin5gµm()
0.87 TYP.
6/Feb. 23, 2001
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in
storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name,
package name, pin number, package code and desired mounting conditions (reflow method, temperature and
times).
42/44

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