MT48LC8M32B2 View Datasheet(PDF) - Micron Technology

Part Name

Description

Manufacturer

MT48LC8M32B2

SYNCHRONOUS DRAM

Micron Technology 

PRELIMINARY

256Mb: x32

SDRAM

0.65 ±0.05

90-BALL FBGA (8mm x 13mm)

SEATING PLANE

C

0.10 C

90X Ø0.45 ±0.05

SOLDER BALL DIAMETER

REFERS TO POST REFLOW

CONDITION. THE PRE-

REFLOW DIAMETER IS Ø0.42

BALL A9

6.40

0.80 TYP

BALL A1 ID

BALL A1

SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2% Ag OR

96.5% Sn, 3%Ag, 0.5% Cu

SOLDER MASK DEFINED BALL PADS: Ø0.40

SUBSTRATE MATERIAL: PLASTIC LAMINATE

MOLD COMPOUND: EPOXY NOVOLAC

BALL A1 ID

11.20 ±0.10

0.80 TYP

CL

13.00 ±0.10

5.60 ±0.05

6.50 ±0.05

CL

3.20 ±0.05 4.00 ±0.05

8.00 ±0.10

1.00 MAX

(Bottom View)

NOTE: 1. All dimensions in millimeters.

2. Recommended pad size for PCB is 0.33mm±0.025mm.

Preliminary: This data sheet contains initial characterization limits that are subject to change upon full

characterization of production devices.

8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900

E-mail: prodmktg@micronsemi.com, Internet: http://www.micronsemi.com, Customer Comment Line: 800-932-4992

Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc.

All other trademarks are the property of their respective owners.

09005aef80cd8e48

256MbSDRAMx32.p65 – Rev. B; Pub. 03/04

55

Micron Technology, Inc., reserves the right to change products or specifications without notice.

©2003 Micron Technology, Inc.

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