MTY25N60E View Datasheet(PDF) - Motorola => Freescale
Part Name
Description
Manufacturer
MTY25N60E Datasheet PDF : 8 Pages
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12
600
QT
10
500
8
VGS
400
6
Q2
Q1
4
300
TJ = 25°C 200
ID = 25 A
2
Q3
0
0
50
VDS
100
150
200
Qg, TOTAL GATE CHARGE (nC)
100
0
250
Figure 8. Gate Charge versus Gate–to–Source Voltage
10000
1000
VDD = 300 V
ID = 25 A
VGS = 10 V
TJ = 25°C
MTY25N60E
td(off)
100
tf
tr
td(on)
10
1
10
100
RG, GATE RESISTANCE (OHMS)
Figure 9. Resistive Switching Time
Variation versus Gate Resistance
DRAIN–TO–SOURCE DIODE CHARACTERISTICS
25
20
VGS = 0 V
TJ = 25°C
15
10
5
0
0.5 0.55 0.6 0.65 0.7 0.75 0.8 0.85 0.9
VSD, SOURCE–TO–DRAIN VOLTAGE (VOLTS)
Figure 10. Diode Forward Voltage versus Current
SAFE OPERATING AREA
The Forward Biased Safe Operating Area curves define
able operation, the stored energy from circuit inductance dis-
the maximum simultaneous drain–to–source voltage and
sipated in the transistor while in avalanche must be less than
drain current that a transistor can handle safely when it is for-
the rated limit and adjusted for operating conditions differing
ward biased. Curves are based upon maximum peak junc-
tion temperature and a case temperature (TC) of 25°C. Peak
repetitive pulsed power limits are determined by using the
thermal response data in conjunction with the procedures
discussed in AN569, “Transient Thermal Resistance–General
Data and Its Use.”
Switching between the off–state and the on–state may tra-
verse any load line provided neither rated peak current (IDM)
nor rated voltage (VDSS) is exceeded and the transition time
(tr,tf) do not exceed 10 µs. In addition the total power aver-
aged over a complete switching cycle must not exceed
from those specified. Although industry practice is to rate in
terms of energy, avalanche energy capability is not a con-
stant. The energy rating decreases non–linearly with an in-
crease of peak current in avalanche and peak junction
temperature.
Although many E–FETs can withstand the stress of drain–
to–source avalanche at currents up to rated pulsed current
(IDM), the energy rating is specified at rated continuous cur-
rent (ID), in accordance with industry custom. The energy rat-
ing must be derated for temperature as shown in the
(TJ(MAX) – TC)/(RθJC).
A Power MOSFET designated E–FET can be safely used
accompanying graph (Figure 12). Maximum energy at cur-
rents below rated continuous ID can safely be assumed to
in switching circuits with unclamped inductive loads. For reli-
equal the values indicated.
Motorola TMOS Power MOSFET Transistor Device Data
5
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