NCP1611BDR2G(2011) View Datasheet(PDF) - ON Semiconductor
Part Name
Description
Manufacturer
NCP1611BDR2G Datasheet PDF : 28 Pages
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NCP1611
TYPICAL CHARACTERISTICS
25
70
60
20
50
15
40
10
5
0
−50 −30 −10 10 30 50 70 90 110 130
TJ, JUNCTION TEMPERATURE (°C)
Figure 15. DRV Source Resistance vs.
Temperature
30
20
10
0
−50 −30 −10 10 30 50 70 90 110 130
TJ, JUNCTION TEMPERATURE (°C)
Figure 16. DRV Voltage Rise−Time (CL = 1 nF,
10−90% of Output Signal) vs. Temperature
25
70
60
20
50
15
40
10
5
0
−50 −30 −10 10 30 50 70 90 110 130
TJ, JUNCTION TEMPERATURE (°C)
Figure 17. DRV Sink Resistance vs.
Temperature
20
30
20
10
0
−50 −30 −10 10 30 50 70 90 110 130
TJ, JUNCTION TEMPERATURE (°C)
Figure 18. DRV Voltage Fall−Time (CL = 1 nF,
10−90% of Output Signal) vs. Temperature
2.65
16
2.60
2.55
12
2.50
8
2.45
4
2.40
0
−50 −30 −10 10 30 50 70 90 110 130
TJ, JUNCTION TEMPERATURE (°C)
Figure 19. DRV Pin Level @ VCC = 35 V (RL =
33 kW, CL = 1 nF) vs. Temperature
2.35
−50 −30 −10 10 30 50 70 90 110 130
TJ, JUNCTION TEMPERATURE (°C)
Figure 20. Feedback Reference Voltage vs.
Temperature
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