NCP1611BDR2G(2011) View Datasheet(PDF) - ON Semiconductor
Part Name
Description
Manufacturer
NCP1611BDR2G Datasheet PDF : 28 Pages
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NCP1611
Vin
Ac line
R X1
R X2
IL
Rbo1
EMI
Filter
Rz
Cin
Rbo2
Rfb2
Cz
Cp
Feedback
Vbulk
Rfb1
1
8
2
7 Vcc
3
6
4
5
R FF
Figure 1.
. L1
.
D1
Dzcd
Vbulk
R zcd
Q1
Rocp
R sense
Cbulk
LOAD
MAXIMUM RATINGS TABLE
Symbol
Pin
Rating
Value
Unit
VCC
Vi
VCONTROL
DRV
7
2, 3, 4, 8
1
6
Power Supply Input
Input Voltage (Note 1)
VCONTROL pin
Driver Votage
Driver Current
−0.3, + 35
V
−0.3, +10
V
−0.3, VCONTROLMAX*
V
−0.3, VDRV*
V
−500, +800
mA
PD
RqJA
TJ
TJmax
TSmax
TLmax
MSL
Power Dissipation and Thermal Characteristics
Maximum Power Dissipation @ TA = 70°C
Thermal Resistance Junction−to−Air
Operating Junction Temperature Range
Maximum Junction Temperature
Storage Temperature Range
Lead Temperature (Soldering, 10s)
Moisture Sensitivity Level
550
145
−40 to+125
150
−65 to 150
300
3
mW
°C/W
°C
°C
°C
°C
−
ESD Capability, Human Body Model (Note 2)
> 4000
V
ESD Capability, Machine Model (Note 2)
> 200
V
ESD Capability, Charged Device Model (Note 2)
2000
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
*“VCONTROLMAX” is the VCONTROL pin clamp voltage. “VDRV” is the DRV clamp voltage (VDRVhigh) if VCC is higher than (VDRVhigh). “VDRV” is
VCC unless otherwise noted.
1.
When
the
applied
voltage exceeds
5
V,
these
pins
sink about
VI *
5
V
that
is
about
1.25
mA
if
VI
=
10
V.
4 kW
2. This device(s) contains ESD protection and exceeds the following tests:
Human Body Model 2000 V per JEDEC Standard JESD22−A114E
Machine Model Method 200 V per JEDEC Standard JESD22−A115−A
Charged Device Model Method per JEDEC Standard JESD22−C101E.
3. This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78.
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