NCP382 View Datasheet(PDF) - ON Semiconductor
Part Name
Description
Manufacturer
NCP382 Datasheet PDF : 12 Pages
| |||
NCP382
PACKAGE DIMENSIONS
DFN8, 3x3, 0.65P
CASE 506BW
ISSUE O
D
PIN ONE
REFERENCE
2X
0.10 C
ÉÉÉÉÉÉÉÉÉ
2X
0.10 C TOP VIEW
0.05 C
DETAIL B
0.05 C
NOTE 4
SIDE VIEW
DETAIL A
D2
1
4
8X L
8X K
8
5
e/2
e
BOTTOM VIEW
A
L
L
B
L1
DETAIL A
OPTIONAL
E
CONSTRUCTIONS
ÉÉÉÉ EXPOSED Cu
MOLD CMPD
(A3) A
DETAIL B
OPTIONAL
CONSTRUCTIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.25 0.35
D 3.00 BSC
D2 2.30 2.50
E 3.00 BSC
E2 1.55 1.75
e 0.65 BSC
K 0.20 −−−
L 0.35 0.45
L1 0.00 0.15
A1
C
SEATING
PLANE
E2
8X b
0.10 C A B
0.05 C NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
ÇÇÇÇÇÇÇÇÇÇÇÇ 2.50
8X
0.62
1.75
3.30
ÇÇ1ÇÇÇÇÇÇÇÇÇÇ8X
0.65
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
11
Share Link: 