NCP4629(2010) View Datasheet(PDF) - ON Semiconductor
Part Name
Description
Manufacturer
NCP4629 Datasheet PDF : 6 Pages
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NCP4629
APPLICATION INFORMATION
A typical application circuit for NCP4629 series is shown
in Figure 3.
VIN
C1
470 n
NCP4629x
VIN
VOUT
CE
GND
VOUT
C2
10 m
Figure 3. Typical Application Schematic
When VOUT voltage could be higher than VIN voltage it
is necessary to use protective diode D1. If there is possibility
that VOUT voltage could be negative then it is necessary to
use schottky diode D2. See Figure 4 for details. Do not force
the voltage to the VOUT pin.
D1
VIN
C1
470 n
NCP4629x
VIN
VOUT
CE
GND
VOUT
C2
10 m
D2
Figure 4. Typical Application Schematic with
Protective Diodes
Input Decoupling Capacitor (C1)
A 470 nF ceramic input decoupling capacitor should be
connected as close as possible to the input and ground pin of
the NCP4629. Higher values and lower ESR improves line
transient response.
Output Decoupling Capacitor (C2)
A 10 mF ceramic output decoupling capacitor is sufficient
to achieve stable operation of the IC. If tantalum capacitor
is used, and its ESR is high, the loop oscillation may result.
The capacitor should be connected as close as possible to the
output and ground pin. Larger values and lower ESR
improves dynamic parameters.
Enable Operation
The enable pin CE may be used for turning the regulator
on and off. The IC is switched on when a high level voltage
is applied to the CE pin. The enable pin has an internal pull
down current source. If the enable function is not needed
connect CE pin to VIN.
Thermal
As a power across the IC increase, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and also the ambient
temperature affect the rate of temperature increase for the
part. When the device has good thermal conductivity
through the PCB the junction temperature will be relatively
low in high power dissipation applications.
The IC includes internal thermal shutdown circuit that
stops operation of regulator, if junction temperature is
higher than 160°C. After that, when junction temperature
decreases below 135°C, the operation of voltage regulator
would restart. While high power dissipation condition is, the
regulator starts and stops repeatedly and protects itself
against overheating.
PCB layout
Pins number 2 and 3 must be wired to the GND plane
while it is mounted on board. Make VIN and GND lines
sufficient. If their impedance is high, noise pickup or
unstable operation may result. Connect capacitors C1 and
C2 as close as possible to the IC, and make wiring as short
as possible.
ORDERING INFORMATION
Device
Nominal Output
Voltage
Description
Marking
Package
Shipping†
NCP4629HDT050T5G
5.0 V
Enable High
C1J050B
DPACK−5
(Pb−Free)
3000 / Tape & Reel
NCP4629HDT060T5G
6.0 V
Enable High
C1J060B
DPACK−5
(Pb−Free)
3000 / Tape & Reel
NCP4629HDT120T5G
12.0 V
Enable High
C1J120B
DPACK−5
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*To order other package and voltage variants, please contact your ON Semiconductor sales representative.
http://onsemi.com
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