NCP5500 View Datasheet(PDF) - ON Semiconductor
Part Name
Description
Manufacturer
NCP5500 Datasheet PDF : 16 Pages
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SCALE 1:1
B
V
R
DPAK−5, CENTER LEAD CROP
CASE 175AA
ISSUE B
−T−
SEATING
PLANE
C
E
R1
A
S
12 3 4 5
K
Z
U
F
J
L
H
D 5 PL
G
0.13 (0.005) M T
RECOMMENDED
SOLDERING FOOTPRINT*
6.4
0.252
2.2
0.086
DATE 15 MAY 2014
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
A 0.235 0.245
B 0.250 0.265
C 0.086 0.094
D 0.020 0.028
E 0.018 0.023
F 0.024 0.032
G 0.180 BSC
H 0.034 0.040
J 0.018 0.023
K 0.102 0.114
L 0.045 BSC
R 0.170 0.190
R1 0.185 0.210
S 0.025 0.040
U 0.020 −−−
V 0.035 0.050
Z 0.155 0.170
MILLIMETERS
MIN MAX
5.97 6.22
6.35 6.73
2.19 2.38
0.51 0.71
0.46 0.58
0.61 0.81
4.56 BSC
0.87 1.01
0.46 0.58
2.60 2.89
1.14 BSC
4.32 4.83
4.70 5.33
0.63 1.01
0.51 −−−
0.89 1.27
3.93 4.32
GENERIC
MARKING DIAGRAMS*
XXXXXXG
ALYWW
AYWW
XXX
XXXXXG
5.8
0.228
0.34 5.36
0.013 0.217
10.6
0.417
0.8
0.031
ǒ Ǔ SCALE 4:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
IC
Discrete
XXXXXX
A
L
Y
WW
G
= Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
DOCUMENT NUMBER:
DESCRIPTION:
98AON12855D
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DPAK−5 CENTER LEAD CROP
PAGE 1 OF 1
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