NCV47701
ABSOLUTE MAXIMUM RATINGS (Note 1)
Rating
Symbol
Min
Max
Unit
Input Voltage
Vin
−42
45
V
Enable Input Voltage
VEN
−42
45
V
Adjustable Input Voltage
VADJ
−0.3
10
V
CSO Voltage
VCSO
−0.3
7
V
Output Voltage
Vout
−1
40
V
Junction Temperature
TJ
−40
150
°C
Storage Temperature
TSTG
−55
150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
ESD CAPABILITY (Note 2)
Rating
Symbol
Min
Max
Unit
ESD Capability, Human Body Model
ESDHBM
ESD Capability, Machine Model
ESDMM
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
−2
−200
2
kV
200
V
LEAD SOLDERING TEMPERATURE AND MSL (Note 3)
Rating
Symbol
Min
Max
Unit
Moisture Sensitivity Level
SOIC−8 EP
MSL
2
−
SOIC−8
1
Lead Temperature Soldering, Reflow (SMD Styles Only), Pb−Free Versions
TSLD
−
265 peak
°C
3. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
THERMAL CHARACTERISTICS (Note 4)
Rating
Symbol
Value
Unit
Thermal Characteristics, SOIC−8 EP (single layer PCB)
Thermal Resistance, Junction−to−Air (Note 5)
Thermal Reference, Junction−to−Lead (Note 5)
RθJA
RψJL
°C/W
70
19
Thermal Characteristics, SOIC−8 EP (4 layers PCB)
Thermal Resistance, Junction−to−Air (Note 5)
Thermal Reference, Junction−to−Lead (Note 5)
RθJA
RψJL
°C/W
29
12
Thermal Characteristics, SOIC−8 (single layer PCB)
Thermal Resistance, Junction−to−Air (Note 5)
Thermal Reference, Junction−to−Lead (Note 5)
RθJA
RψJL
°C/W
121
42
Thermal Characteristics, SOIC−8 (4 layers PCB)
Thermal Resistance, Junction−to−Air (Note 5)
Thermal Reference, Junction−to−Lead (Note 5)
RθJA
RψJL
°C/W
77
52
4. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
5. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate. Single layer − according to JEDEC51.3,
4 layers − according to JEDEC51.7.
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3