P89LPC932BA View Datasheet(PDF) - Philips Electronics

Part Name

Description

Manufacturer

P89LPC932BA

8-bit microcontroller with accelerated two-clock 80C51 core 8 kB Flash with 512-byte data EEPROM and 768-byte RAM

Philips Electronics 

Philips Semiconductors

P89LPC932

8-bit microcontroller with accelerated two-clock 80C51 core

[3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must

on no account be processed through more than one soldering cycle or subjected to infrared reflow

soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow

oven. The package body peak temperature must be kept as low as possible.

[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom

side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with

the heatsink on the top side, the solder might be deposited on the heatsink surface.

[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it

is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7] Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered

pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex

foil by using a hot bar soldering process. The appropriate soldering profile can be provided on

request.

[9] Hot bar soldering or manual soldering is suitable for PMFP packages.

15. Revision history

Table 13: Revision history

Rev Date

CPCN

Description

04 20040106 -

Product data (9397 750 12379); ECN 853-2433 01-A15016 dated 16 December 2003

03 20031007 -

Modifications:

• Table 4 “Special function registers”: changed PLEEN to PLLEN.

• Section 8.27.2 “Features” on page 41: adjusted bullet for erase/program cycles

• Table 8 “DC electrical characteristics” on page 45: adjusted value for ITL VIN.

Product data (9397 750 12119); ECN 853-2433 30392 dated 30 September 2003

02 20030725 -

Product data (9397 750 11712); ECN 853-2433 30141 dated 23 July 2003.

Supersedes Preliminary data P89LPC932_1 of 21 October 2002 (9397 750 10475)

9397 750 12379

Product data

Rev. 04 — 06 January 2004

© Koninklijke Philips Electronics N.V. 2004. All rights reserved.

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