PC8240 View Datasheet(PDF) - Atmel Corporation
Part Name
Description
Manufacturer
PC8240 Datasheet PDF : 42 Pages
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Figure 3 shows the undershoot and overshoot voltage of the memory interface of the
PC8240.
Figure 3. Overshoot/Undershoot Voltage
4V
GVdd + 5%
VIH
GVdd
Thermal Information
Thermal Characteristics
Thermal Management
Information
Gnd
VIL
Gnd ± 0.3V
Gnd ± 1.0V
Not to exceed 10%
of tSDRAM_CLK
Table 4. Package Thermal Characteristics
Symbol
Characteristic
θJC
Die Junction-to-Case Thermal Resistance
θJB
Die Junction-to-Board Thermal Resistance
Min
Unit
1.8
°C/W
4.8
°C/W
This section provides thermal management information for the tape ball grid array
(TBGA) package for air-cooled applications. Proper thermal control design is primarily
dependent upon the system-level design, the heat sink, airflow and thermal interface
material. To reduce the die-junction temperature, heat sinks may be attached to the
package by several methods-adhesive, spring clip to holes in the printed-circuit board or
package, and mounting clip and screw assembly; see Figure 4.
Figure 4. Package Exploded Cross-Sectional View with Several Heat Sink Options
Heat Sink
TBGA Package
Heat Sink
Clip
Adhesive
or
Thermal Interface
Material
Die
10 PC8240
Printed-Circuit Board Option
2149A–HIREL–05/02
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