PCF1175CT/F2 View Datasheet(PDF) - Philips Electronics

Part Name

Description

Manufacturer

PCF1175CT/F2

4-digit duplex LCD car clock

Philips Electronics 

Philips Semiconductors

4-digit duplex LCD car clock

CHIP DIMENSIONS AND BONDING PAD LOCATIONS

Product specification

PCF1175C

y

A2/ADEG1

AM/PM

BP2

BP1

2.92 mm

S1

DATA

OSC IN

OSC OUT

0

0

PCF1175CU

1.92 mm

G3/AD3

B3/C3

F4/E4

G4/D4

B4/C4

S2

SEL

FLASH

x

MSB224

Chip area: 5.61 mm2.

Bonding pad dimensions: 110 µm × 110 µm.

Chip thickness: 381 ±25 µm.

Fig.7 Bonding pad locations, PCF1175CU; 28 terminals.

1997 Apr 16

11

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