Philips Semiconductors
PNP/PNP resistor-equipped transistors;
R1 = 10 kΩ, R2 = 47 kΩ
Product specification
PEMB9; PUMB9
ORDERING INFORMATION
TYPE NUMBER
PEMB9
−
PUMB9
−
NAME
PACKAGE
DESCRIPTION
plastic surface mounted package; 6 leads
plastic surface mounted package; 6 leads
VERSION
SOT666
SOT363
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
Per transistor
VCBO
collector-base voltage
open emitter
−
VCEO
collector-emitter voltage
open base
−
VEBO
emitter-base voltage
open collector
−
VI
input voltage
positive
−
negative
−
IO
output current (DC)
−
ICM
peak collector current
−
Ptot
total power dissipation
Tamb ≤ 25 °C
SOT363
note 1
−
SOT666
notes 1 and 2
−
Tstg
storage temperature
−65
Tj
junction temperature
−
Tamb
operating ambient temperature
−65
Per device
Ptot
total power dissipation
Tamb ≤ 25 °C
SOT363
note 1
−
SOT666
notes 1 and 2
−
Notes
1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint.
2. Reflow soldering is the only recommended soldering method.
MAX.
UNIT
−50
V
−50
V
−10
V
+6
V
−40
V
−100
mA
−100
mA
200
mW
200
mW
+150
°C
150
°C
+150
°C
300
mW
300
mW
2003 Oct 03
3